Simon Fraser University

PVD 5


Thermal: Cr, Au, Al, Cu, Ag, Ni, In, Au:Ge

- sources: 2 thermal
- co-deposition capability
- processing for small pieces, 50 mm, and 100 mm wafers
 


Tool Status Up
Manufacturer Custom built
Typical Application Thermal deposition
Location 6140
Related Documents
Contact Information

Training

Chris Balicki balicki@4dlabs.ca