Simon Fraser University

PVD 5


Thermal: Cr, Au, Al, Cu, Ag, Ni, In, Au:Ge

- sources: 2 thermal
- co-deposition capability
- processing for small pieces, 50 mm, and 100 mm wafers
 


Tool Status Up
Manufacturer Custom built
Typical Application Thermal deposition
Location 6076
Related Documents
Contact Information

Training

Abbin Perunnilathil Joy aperunni@sfu.ca