Simon Fraser University

RIE 2


Anisotropic etching of SiO2, Si3N4, and Si with CF4, CHF3, SF6, and O2
Resist stripping or ashing with O2
Endpoint detection via spectrometer
Processing for small pieces, 50 and 100 mm wafers

 


Tool Status Up
Manufacturer Sentech
Model Etchlab 200
Typical Application Si, SiO2, and Si3N4 etching
Location 6060.6
Related Documents
Contact Information

Training

Hadi Esmaeilsabzali hesmaeil@sfu.ca